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Description
Carbon nanotube filmProduct Name Name: Carbon Nanatube Film Product Overview This product is a carbon nanotube film prepared by the CVD method, which is composed of a certain length of disordered carbon nanotubes interwoven with each other to form micropores. No binder, surfactant and other substances, good flexibility. Carbon nanotube films prepared by the CVD method have some significant advantages, such as the ability to achieve large area, high quality and controlled
Product Name
Name: Carbon Nanatube Film
Product Overview
This product is a carbon nanotube film prepared by the CVD method, which is composed of a certain length of disordered carbon nanotubes interwoven with each other to form micropores. No binder, surfactant and other substances, good flexibility. Carbon nanotube films prepared by the CVD method have some significant advantages, such as the ability to achieve large area, high quality and controlled growth. In the preparation process, by precisely regulating the reaction parameters, such as temperature, pressure, gas flow and catalyst, the diameter, length, density and arrangement of carbon nanotubes can be controlled, so as to meet the needs of different application scenarios.
Technical Parameter
Conductivity: >3x104 S/m
Thickness:10-15 μm
Metal content: :0%
Strength: 60-120 MPa
Flexibility: bend over and over again
Product Features
Good flexibility: It can be bent at will to meet the needs of flexible electrodes.
Good electrical conductivity: carbon nanotube paper has a high electrical conductivity and can be used to prepare electrode materials.
Good thermal conductivity: can be used as heat dissipation material for high-power electronic devices.
Good chemical stability: good corrosion resistance and oxidation resistance.
Application Fields
Electronic devices: such as transistors, sensors, displays, etc.
Energy field: Can be used for fuel cells, lithium-ion batteries, etc.
Composite materials: composite with polymers and other materials to prepare high-performance composite materials.
Heat dissipation material: used for heat dissipation of high-power electronic devices.
Catalyst carrier: Support catalyst to improve catalytic efficiency.
Related Information
Please e-mail for the detailed characterization data.
E-mail:[email protected]
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
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- Standard Shipping : 3-10 business days
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Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
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